Method of attaching electronic component and electronic component attaching tool

ABSTRACT

An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a method of attaching anelectronic component, and an electronic component attaching tool.Specifically, the present invention relates to a method of attaching anelectronic component such as a semiconductor device (whoserepresentative is an LSI) and a ceramic condenser to an attachmentobject such as an IC socket while the position of the electroniccomponent is aligned to the attachment object, and relates to anelectronic component attaching tool used in this method.

2. Description of the Related Art

Recently, an electronic device having installed electronic components,and mainly a portable device such as a portable terminal, a cellularphone, and a digital still camera have rapidly become smaller andlighter. Accompanying this fact, electronic components (whoserepresentative is a semiconductor device) that are installing componentsfor such a downsized electronic device are greatly demanded to besmaller and lighter.

For this demand, a semiconductor device having a package form (referredto as Chip Size Package CSP has been rapidly introduced. The packagesize of the semiconductor device is made to be near the chip size. Therepresentatives of the CSP are Fine-pitch Ball Grid Array FBGA,Fine-pitch Land Grid Array FLGA, and so on.

Such a semiconductor device is made to be downsized, so that an externalterminal of the semiconductor device is also made to have a minute size.Accordingly, when testing is performed on the semiconductor device, whenthe semiconductor device is attached on a tray or the like, or when thesemiconductor device is attached on a substrate or the like, thesemiconductor device is aligned with high accuracy to the attachmentobject such as an IC socket, an IC tray, and an attachment substrate towhich the semiconductor device is attached.

Before the CSP was realized, a Small Out-line J-Leaded Package SOJ, aThin Small Out-line Package TSOP and the like were generally used as thepackage form of the downsized semiconductor device. Even when the chipsize of the semiconductor chip that was attached in the package waschanged, the external shape of the package that encloses thesemiconductor device was set to the same, that is, not changed. For thisreason, the largest size of the semiconductor devices to be attached inthe package was used as a standard when the package was designed.Accordingly, the external shape of the semiconductor device package wasconventionally larger than the size of the semiconductor device attachedin the package.

On the other hand, the semiconductor device needs to be attached at thepredetermined position on the attachment object such as the IC socket,the tray, and the attachment substrate with high accuracy. According toJapanese Laid-Open Patent Application No. 10-97887, the attachmentobject has a position alignment structure for positioning thesemiconductor device at a predetermined position.

This position alignment structure uses the external shape of thesemiconductor devices (electronic components) to be generally attachedin the package form. The position alignment using the external shape ofthe electronic components was applied in order to simplify the positionalignment structure, facilitate the position alignment, and improve theaccuracy of the position alignment.

Conventionally, the packages of the semiconductor devices have thecommon external shape, so that one position alignment structure suitablefor the common package external shape can cope with varioussemiconductor devices.

However, in the case of the CSP whose size is made to be near thesmaller chip size, when the chip size is changed, the package size isinevitably changed. Furthermore, in the case of a memory device, thechip size shrinks every about six months even for the same type memorydevice. Accompanying this chip size change, the package size of thememory device is also changed.

Accordingly, one position alignment structure of the attachment objectsuch as the IC socket, the tray, and the attachment substrate no longercan cope with the downsized devices. For this reason, position alignmentstructures that correspond to package sizes of the respective CSPs weredeveloped and manufactured so as to be incorporated in the attachmentobject each time the package size is changed.

FIGS. 1 through 3 show how the conventionally used attachment objectcopes with the change in the electronic component size. In FIGS. 1through 3, the CPSs are shown as an example of an electronic component.

For example, it is assumed that before the chip size is changed, asemiconductor chip 2A is cut out from a wafer 1A, and the semiconductorchip 2A is packaged to form a semiconductor device 3A (CSP). As shown inFIG. 2A, the side length of the semiconductor device 3A is “A”, and thepitch of bumps 4 of the semiconductor device 3A is “a”.

The thus-manufactured semiconductor device 3A is attached to theattachment object at the time of the testing, the shipment, thesubstrate attachment, and the like. FIG. 1 shows the state where thesemiconductor device 3A is attached to the IC socket 5A as theattachment object for the testing, the state where the semiconductordevice 3A is attached to the tray 6A as the attachment object for theshipment, and the state where the semiconductor device 3A is attached tothe attachment substrate 8A. FIG. 2B shows the detailed state where thesemiconductor device 3A is attached to the IC socket 5A.

When the chip size shrinks, and a semiconductor chip 2B that is smallerthan the semiconductor chip 2A is cut out from a wafer 1B, asemiconductor device 3B that is smaller than the semiconductor device 3Ais used for enclosing the semiconductor chip 2B. FIGS. 3A and 3B areenlarged views showing the semiconductor devices 3B and 3A. As shown inFIG. 3A, the side length of the semiconductor device is “B” (B<A). Thepitch “b” of bumps of the semiconductor device 3B is equal to the pitchof the bumps 4 of the semiconductor device 3A (b=a).

As described above, conventionally, when the package size is changedfrom the semiconductor device 3A to the semiconductor device 3B, all ofthe attachment objects were changed to be suitable ones for thesemiconductor devices 3B. In other words, the position alignmentstructures of the IC socket 5A, the tray 6A, the attachment substrate 8Athat are the attachment objects are made based on the external shape ofthe semiconductor device 3A. Accordingly, these attachment objects forthe semiconductor device 3A cannot be used for the semiconductor device3B whose shape is different from the shape of the semiconductor device3A.

For this reason, conventionally, when the package size is changed fromthe semiconductor device 3A to the semiconductor device 3B, the ICsocket 5A is replaced with an IC socket 5B suitable for thesemiconductor device 3B, the tray 6A is replaced with a tray 6B suitablefor the semiconductor device 3B, and the attachment substrate 8A isreplaced with an attachment substrate 8B suitable for the semiconductordevice 3B.

Thus, when the package size is changed, the attachment object, and theposition alignment structure of the attachment object need to beentirely changed, resulting in a large cost. Furthermore, a process ofchanging the position alignment structure requires much time, and theserviceability ratio of the attachment objects are lowered.

In addition, when the package size is changed, and a period for changingand developing the position alignment structure is long, a serviceperiod of the developed position alignment structure becomes shortbecause the life cycle of the semiconductor device is short. As aresult, an equipment cost generated by the package size change cannot berecovered.

SUMMARY OF THE INVENTION

In view of the foregoing, it is an object of the present invention toprovide an electronic component attaching method and an electroniccomponent attaching tool in which even when the size of the electroniccomponent is changed, position alignment of electronic components havingvarious sizes can be performed without changing an attachment object towhich the electronic components are attached.

According to one aspect of the present invention, there is provided amethod of attaching to a predetermined attachment position of anattachment object a first electronic component and a second electroniccomponent, an external size of the first electronic component beingdifferent from an external size of the second electronic component,comprising the steps of:

preparing a first electronic component attaching tool for the firstelectronic component, wherein the first electronic component attachingtool has a function of aligning the first electronic component to thepredetermined attachment position of the attachment object;

preparing a second electronic component attaching tool for the secondelectronic component, wherein the second electronic component attachingtool has a function of aligning the second electronic component to thepredetermined position of the attachment object;

attaching the first electronic component attaching tool or the secondelectronic component attaching tool to a standard part formed on theattachment object in accordance with a first case where the firstelectronic component is attached to the predetermined attachmentposition or a second case where the second electronic component isattached to the predetermined attachment position, wherein the formingof the standard part does not substantially depend on the external sizesof the first and second electronic components;

in the first case, by using the first electronic component attachingtool, attaching the first electronic component to the attachment objectwith the position of the first electronic component being aligned to thepredetermined attachment position;

removing the first electronic component attaching tool from theattachment object;

in the second case, by using the second electronic component attachingtool, attaching the second electronic component to the attachment objectwith the position of the second electronic component being aligned tothe predetermined attachment position; and

removing the second electronic component attaching tool from theattachment object.

According to another aspect of the present invention, there is providedan electronic component attaching tool for attaching an electroniccomponent to a predetermined attachment position of an attachmentobject, comprising:

a main body;

a first structure part that is formed on the main body, wherein aposition of the first structure part is aligned to a standard partformed on the attachment object, and the forming of the standard partdoes not substantially depend on an external shape of the electroniccomponent; and

a second structure part that is formed in accordance with the externalshape of the electronic component so as to have a function of aligning aposition of the electronic component to the predetermined position ofthe attachment object in a state where the first structure part isaligned and attached to the standard part.

With this method and tool, when the electronic components havingdifferent sizes are attached to the attachment object, it is notnecessary to prepare different attachment objects for the respectivedifferent electronic components. In other words, only by selectivelyattaching the different electronic component attaching tools to thestandard part formed on attachment object, it is possible to align andattach the electronic components having the different sizes to theattachment object.

Furthermore, when one electronic component having one external shape tobe attached to the attachment object is replaced with another electroniccomponent having another external shape, only the electronic componentattaching tool is replaced, and there is no necessity that theattachment object be modified.

Accordingly, it is possible to promptly cope with the change of theelectronic component to be attached to the attachment object, andtherefore, it is possible to certainly cope with the short life cycle ofthe electronic component. In addition, the serviceability ratio of theattachment object and the throughput by the attachment object can beimproved, reducing a cost for the electronic component. Moreover, whenthe electronic component to be attached to the attachment object ischanged, it is not necessary to modify the attachment object, reducingan equipment cost required for the change of the electronic component.

Further, the electronic component attaching tool can be removed from theattachment object without adversely affecting the position of theelectronic component attached to the attachment object and withoutadversely affect the condition of the connection between the electroniccomponent and the attachment object. Thereby, after the electroniccomponent is aligned and attached to the attachment object by theelectronic component attaching tool, it is not necessary to maintain thestate in which the electronic component attaching tool is mounted on theattachment object. Therefore, when there are a plurality of attachmentobjects to which the electronic components are attached, one electroniccomponent attaching tool enables the electronic components to beattached to a plurality of the attachment objects, respectively.

Furthermore, the electronic component attaching tool may include anopening for aligning the position of the electronic component to theattachment object. By dropping the electronic component free to theopening, the electronic component can be automatically aligned andattached to the attachment object, so that it is possible to easilyalign and attach the electronic component to the attachment object.

Moreover, the electronic component attaching tool may include a holdingmechanism that holds the electronic component. While the holdingmechanism holds the electronic component, the electronic componentattaching tool may be mounted on the attachment object. Thereby, at thesame time the electronic component attaching tool is mounted on theattachment object, the electronic component can be attached to theattachment object. Therefore, it is possible to improve the efficiencyof aligning and attaching the electronic component to the attachmentobject.

Further, while the electronic component is held by the electroniccomponent attaching tool, the electronic component may be opticallytested by optical means via the opening of the electronic componentattaching tool. When the electronic component is held by the electroniccomponent attaching tool, the bottom part of the electronic componentmay be exposed via the opening. In this manner, it is possible to testthe electronic component without removing the electronic component fromthe electronic component attaching tool. Therefore, it is possible toimprove the efficiency of testing the electronic component.

Furthermore, the electronic component may be a chip size package.

The attachment object may be an open top type IC socket. By pushing theIC socket via the electronic component attaching tool, a contact pin ofthe IC socket may be connected to or released from a terminal of theelectronic component. Therefore, the electronic component attaching toolcan be used for pushing the IC socket.

The attachment object may be a tray, a tape, or an attachment substrate.

Furthermore, a region of the attachment object to which the electroniccomponent is attached may be adhesive. Thereby, the electronic componentis held at the aligned and attached position by the adhesive force, sothat even when or after the electronic component attaching tool isremoved from the attachment object, the electronic component is notmoved from the aligned and attached position.

In addition, a cover may be attached for holding the electroniccomponent in a state in which the electronic component is aligned andattached to the attachment object. In this manner, the electroniccomponent can be held at the aligned and attached position by the cover,so that the electronic component is not moved from this aligned andattached position.

Other objects, features, and advantages of the present invention willbecome more apparent from the following detailed description when readin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an illustration for a problem of a conventional method ofaligning and attaching semiconductor devices to an attachment object;

FIGS. 2A and 2B are illustrations for the problem of the conventionalmethod of aligning and attaching semiconductor devices to an attachmentobject;

FIGS. 3A and 3B are illustrations for the problem of the conventionalmethod of aligning and attaching semiconductor devices to an attachmentobject;

FIG. 4 shows an electronic component attaching tool according to a firstembodiment of the present invention;

FIGS. 5A and 5B are illustrations showing a method of aligning andattaching the electronic component to the attachment object by using theelectronic component attaching tool shown in FIG. 4;

FIGS. 6C and 6D are illustrations showing the method of aligning andattaching the electronic component to the attachment object by using theelectronic component attaching tool shown in FIG. 4;

FIG. 7E is an illustration showing the method of aligning and attachingthe electronic component to the attachment object by using theelectronic component attaching tool shown in FIG. 4;

FIG. 8 is an illustration showing the method of aligning and attachingthe electronic component to the attachment object by using theelectronic component attaching tool shown in FIG. 4;

FIGS. 9A through 9D are illustrations showing the method of aligning andattaching the electronic component to the attachment object by using theelectronic component attaching tool shown in FIG. 4;

FIGS. 10E through 10H are illustrations showing the method of aligningand attaching the electronic component to the attachment object by usinganother electronic component attaching tool according to the firstembodiment of the present invention;

FIG. 11 is an illustration for an advantage achieved by the electroniccomponent attaching tools and the position aligning method according tothe first embodiment of the present invention;

FIG. 12 shows an electronic component attaching tool according to asecond embodiment of the present invention;

FIG. 13 shows an electronic component attaching tool according to athird embodiment of the present invention;

FIG. 14 shows an electronic component attaching tool according to afourth embodiment of the present invention;

FIG. 15 shows an electronic component attaching tool according to afifth embodiment of the present invention;

FIG. 16 shows an electronic component attaching tool according to asixth embodiment of the present invention;

FIGS. 17A through 17C show examples of modifications of groovesaccording to the sixth embodiment of the present invention;

FIG. 18 shows an electronic component attaching tool according to aseventh embodiment of the present invention;

FIG. 19 shows a method of aligning and attaching the electroniccomponent to the attachment object by using the electronic componentattaching tool shown in FIG. 18;

FIG. 20 shows the method of aligning and attaching the electroniccomponent to the attachment object by using the electronic componentattaching tool shown in FIG. 18;

FIG. 21 shows an electronic component attaching tool according to aneighth embodiment of the present invention;

FIGS. 22A and 22B show electronic component attaching tools according toa ninth embodiment of the present invention;

FIGS. 23A through 23C show an electronic component attaching toolaccording to a tenth embodiment of the present invention;

FIGS. 24A and 24B show an electronic component attaching tool and aholding mechanism provided on this electronic component attaching toolaccording to an eleventh embodiment of the present invention;

FIGS. 25A and 25B show an operation of the electronic componentattaching tool and the holding mechanism shown in FIGS. 24A and 24B;

FIGS. 26A and 26B show a method of aligning and attaching the electroniccomponent to the attachment object by using the electronic componentattaching tool shown in FIGS. 24A and 24B;

FIGS. 27C and 27D show the method of aligning and attaching theelectronic component to the attachment object by using the electroniccomponent attaching tool shown in FIGS. 24A and 24B;

FIG. 28E shows the method of aligning and attaching the electroniccomponent to the attachment object by using the electronic componentattaching tool shown in FIGS. 24A and 24B;

FIGS. 29A through 29D show a method of detecting a defect of theelectronic component by using a camera as well as aligning and attachingthe electronic component to the attachment object;

FIG. 30 shows a modification of a testing device that is used for thetesting method shown in FIGS. 29A through 29C;

FIG. 31 shows an electronic component attaching tool according to atwelfth embodiment of the present invention;

FIGS. 32A through 32C show a method of aligning and attaching theelectronic component to the attachment object by using the electroniccomponent attaching tool shown in FIG. 31;

FIG. 33 shows an electronic component attaching tool according to athirteenth embodiment of the present invention;

FIG. 34 shows an electronic component attaching tool having arecognition mark;

FIG. 35 shows an electronic component attaching tool according to afourteenth embodiment of the present invention;

FIGS. 36A through 36C show an electronic component attaching toolaccording to a fifteenth embodiment of the present invention;

FIG. 37 shows a sixteenth embodiment of the present invention;

FIG. 38 shows an example in which the electronic component attachingtool of the first embodiment of the present invention is applied to atray;

FIG. 39 shows the tray of FIG. 38 to which the electronic components areattached;

FIG. 40A shows a tray having adhesive sheets to which the electroniccomponents are attached by using the electronic component attaching toolof the first embodiment of the present invention;

FIG. 40B shows a method of aligning and attaching the electroniccomponent to the tray shown in FIG. 40A by using the electroniccomponent attaching tool of the first embodiment of the presentinvention;

FIGS. 41A and 41B show a method of fixing the electronic componentsattached to a tray by using an upper cover;

FIGS. 42A and 42B show a tray on which position alignment pins andposition alignment holes are formed;

FIG. 43 shows a tray to which the electronic component attaching tool ofthe fourteenth embodiment of the present invention is applied;

FIG. 44 shows a tray to which the sixteenth embodiment of the presentinvention is applied;

FIGS. 45A and 45B show a tape to which the electronic componentattaching tool of the first embodiment of the present invention isapplied;

FIG. 46 shows the tape of FIGS. 45A and 45B;

FIGS. 47A and 47B show a method of aligning and attaching the electroniccomponent to a tape having adhesive sheets, by using the electroniccomponent attaching tool of the first embodiment:

FIGS. 48A and 48B show a method of fixing the electronic componentattached to the tape of FIGS. 45A and 45B by using an upper cover;

FIGS. 49A and 49B show a tape on which position alignment pins andposition alignment holes are formed;

FIGS. 50A and 50B show an example in which the electronic componentattaching tool of the fourteenth embodiment of the present invention isapplied to the tape;

FIG. 51 shows an example in which the sixteenth embodiment of thepresent invention is applied to the tape;

FIG. 52 shows an example in which the electronic component attachingtool of the first embodiment of the present invention is applied to anattachment substrate;

FIGS. 53A and 53B show an attachment substrate on which positionalignment pins and position alignment holes are formed; and

FIG. 54 shows an example in which the sixteenth embodiment of thepresent invention is applied to an attachment substrate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A description will now be given, with reference to the drawings, ofembodiments of the present invention.

FIGS. 4 through 10 show electronic component attaching tools 20A and 20Baccording to a first embodiment of the present invention. The electroniccomponent attaching tools 20A and 20B have functions of aligning thepositions of the semiconductor devices 3A and 3B, respectively, to an ICsocket 30 that is the attachment object at the time of mounting thesemiconductor devices 3A and 3B on the IC socket 30. The semiconductordevices 3A and 3B are examples of electronic components.

In the following embodiments, the semiconductor device whose packageform is a CSP type is used as an example of an electronic component.However, the application of the present invention is not limited to thesemiconductor device, but may be applied to other electronic componentssuch as a ceramic condenser.

Further, in the following embodiments, two types of the semiconductordevices 3A and 3B whose package sizes are different from each other. Thesemiconductor devices 3A and 3B are the same shown in FIGS. 1 through3B. However, the present invention may be applied to an electroniccomponent having three or more size types.

The electronic component attaching tool 20A for the semiconductor device3A differs only in a second structure part or the second structure partsize (that is described later) from the electronic component attachingtool 20B for the semiconductor device 3B. Accordingly, except for anecessity that the description be made by distinguishing thesemiconductor device 3A from the semiconductor device 3B, only theelectronic component attaching tool 20A suitable for the semiconductordevice 3A will be described in the following.

First, a structure of the IC socket 30 that functions as the attachmentobject for attaching the electronic component attaching tool 20A theretowill be described. The IC socket 30 is an open top type IC socket thatdoes not have a lid.

This IC socket 30 includes a fixed part 31 and a movable part 32. Thefixed part 31 is fixed on a test substrate 36 (refer to FIG. 8). Thefixed part 31 is provided with a plurality of contact pins 33 thatcorrespond to the bumps 4 formed on the semiconductor device 3A (and thesemiconductor device 3B).

One end (at the side of the direction Z2 indicated by the arrow “Z2” ofFIG. 4) of each contact pin 33 branches into two portions so as to formpin end portions 33 a and 33 b. When the semiconductor device 3A or 3Bis mounted on the IC socket 30, the bump 4 is sandwiched by a pair ofthe pin end portions 33 a and 33 b so that the bump 4 can beelectrically and mechanically connected to the contact pin 33.

The movable part 32 is structured so as to move in the directions Z1 andZ2 indicated by the arrows “Z1” and “Z2” of FIG. 4 relative to the fixedpart 31. Further, springs 34 are provided between the fixed part 31 andthe movable part 32 such that the movable part 32 is pushed in thedirection “Z2” relative to the fixed part 31 by the springs 34.

The pair of the pin end portions 33 a and 33 b of the contact pin 33 arestructured so as to move or deform, accompanying the movement of themovable part 32. In other words, when the movable part 32 is pushed andmoved in the lower direction “Z1”, the pair of the pin end portions 33 aand 33 b are moved and separated from each other.

The semiconductor device 3A or 3B is attached to the IC socket 30 withthe movable part 32 being pushed in the direction Z1. In the state inwhich the movable part 32 is pushed in the direction Z1, the distancebetween the pair of the pin end portions 33 a and 33 b is widened.Accordingly, the bump 4 of the semiconductor device 3A or 3B can beeasily inserted between the pair of the pin end portions 33 a and 33 b(refer to FIG. 6D).

In the state in which the bump 4 is positioned between the pair of thepin end portions 33 a and 33 b, when the pushing force applied to themovable part 32 is released, the elastic restoring force of the springs34 cause the movable part 32 to move in the direction Z2 (i.e., theupward direction). Accompanying the movement of the movable part 32 inthe direction Z2, the pair of the pin end portions 33 a and 33 b aremoved to be close to each other. In this manner, when the pushing forceapplied to the movable part 32 is released, the bump 4 is sandwiched bythe pair of the pin end portions 33 a and 33 b so that the bump 4 can beelectrically connected to the contact pin 33 and be mechanically fixedto the contact pin 33, that is, the semiconductor device 3A or 3B can befixed on the IC socket 30.

Meanwhile, a depression part is formed at an upper center part of themovable part 32. The inner wall of the depression part is standardsurface 35. This standard surface 35 (the inner wall) is formedsubstantially regardless of the external shape of the semiconductordevices 3A and 3B that are attached to the IC socket 30.

In other words, the standard surface 35 need not have the function ofaligning the position of the semiconductor devices 3A and 3B.Accordingly, the formation size or area of the standard surface 35 islarger than the external sizes or areas of the semiconductor devices 3Aand 3B. As described later, the standard surface 35 is formed with highaccuracy because the standard surface 35 is used for aligning theposition where the electronic component attaching tool 20A is attachedwith high accuracy.

Next, the electronic component attaching tools 20A and 20B will bedescribed. When the electronic component attaching tools 20A and 20B aremounted on the IC socket 30, the electronic component attaching tools20A and 20B function to align the semiconductor devices 3A and 3B topredetermined attachment positions on the IC socket 30. Thepredetermined attachment positions may be the positions where the bumps4 are connected to the contact pins 33. The electronic componentattaching tool 20A may be structured to be suitable for thesemiconductor device 3A, and the electronic component attaching tool 20Bmay be structured to be suitable for the semiconductor device 3B.

The electronic component attaching tools 20A and 20B differ from eachother in the shapes of vertical surfaces 23B and 25B that have thefunction of aligning the positions of the semiconductor devices 3A and3B. Other structures of the electronic component attaching tools 20A and20B are substantially the same. Accordingly, in the following, only theelectronic component attaching tool 20A is described as an example, andthe only different structure of the electronic component attaching tool20B is described.

The electronic component attaching tool 20A includes a main body 21A, anengaging surface 22 (a first structure part) formed on the main body21A, and a position alignment surface 23 (the above-mentioned secondstructure part) formed on the main body 21A. Thus, the electroniccomponent attaching tool 20A has very simple structure, so that it ispossible to manufacture the electronic component 20A at a low cost.

As one example, the materials for the main body 21A may include resinthat has a low thermal expansion rate, high insulation characteristics,and a smooth surface (to be specific, the material for the main body 21Amay include fluoroplastics). The shape of the main body 21A viewed fromthe upper side of the electronic component attaching tool 20A may beapproximately the same as the shape of the IC socket 30 viewed from theupper side of the IC socket 30. An opening 26 is formed at the centerpart of the main body 21A of the electronic component attaching tool20A. As described later, the semiconductor device 3A or 3B is insertedin the opening 26.

The engaging surface 22 that is the first structure part is formed atthe outer surface of the main body 21A. In the state in which theelectronic component attaching tool 20A is mounted on the IC socket 30,the engaging surface 22 engages with an engagement surface formed on theIC socket 30.

The position alignment surface 23 that is the second structure part isformed at an inner surface of the opening formed on the main body 21A.According to the first embodiment, the position alignment surface 23includes an inclination surface 23A and the vertical surface 23B.

The inclination surface 23A guides the insertion of the semiconductordevice 3A when the semiconductor device 3A is inserted into the opening26 of the electronic component attaching tool 20A. The vertical surface23B aligns the semiconductor device 3A to the predetermined attachmentposition on the IC socket 30. Accordingly, the shape of a part of theopening 26 that is defined by the vertical surface 23B may be equal tothe external shape of the semiconductor device 3A, or may be slightlylarger than the external shape of the semiconductor device 3A within therange in which the position alignment of the semiconductor device 3A canbe performed, and the semiconductor device 3A can be smoothly insertedinto the opening 26 of the electronic component attaching tool 20A.

In the above-described structure of the electronic component attachingtool 20A, the opening 26 has an entrance shape (upper side shape) viewedfrom the direction of inserting the semiconductor device into theopening 26, the entrance shape being larger than the external shape ofthe semiconductor device 3A. The opening 26 has an exit shape (lowerside shape) whose size is approximately the same as the external size ofthe semiconductor device 3A. With this structure, at the entrance sideof the electronic component attaching tool 20A, the semiconductor device3A can be easily inserted into the opening 26, and at the exit side ofthe electronic component attaching tool 20A, the position alignment ofthe semiconductor device 3A can be firmly performed.

A brim part 24A that extends in a horizontal direction is formed at theentrance side of the electronic component attaching tool 20A from whichthe semiconductor device 3A is inserted. When the electronic componentattaching tool 20A is mounted on the IC socket 30, the brim part 24A ispositioned on the upper surface of the movable part 32. Accordingly, atthe time of pushing the movable part 32, it is possible to push themovable part 32 via the brim part 24A (the electronic componentattaching tool 20A).

On the other hand, also as for the electronic component attaching tool20B for the semiconductor device 3B, the engaging surface 22 that is thefirst structure part is formed on the outer surface of the main body 21Aof the electronic component attaching tool 20B. The structure of theengaging surface 22 of the electronic component attaching tool 20B isthe same as the engaging surface 22 of the electronic componentattaching tool 20A. When the electronic component attaching tool 20B ismounted on the IC socket 30, the engaging surface 22 of the electroniccomponent attaching tool 20B engages with the engagement surface formedon the IC socket 30.

The electronic component attaching tool 20B also includes a positionalignment surface 25. The position alignment surface 25 that is thesecond structure part includes an inclination surface 25A and a verticalsurface 25B. The inclination surface 25A guides the insertion of thesemiconductor device 3B into the electronic component attaching tool20B. The vertical surface 25B aligns the semiconductor device 3B to apredetermined position on the IC socket 30. An opening 26 is also formedat the center part of the electronic component attaching tool 20B.Therefore, the size of a part of the opening 26 defined by the verticalsurface 25B may be equal to the external size of the semiconductordevice 3B, or may be slightly larger than the external size of thesemiconductor device 3B within the range in which the position alignmentof the semiconductor device 3B can be performed, and the semiconductordevice 3B can be smoothly inserted into the electronic componentattaching tool 20B.

Next, a method of attaching the semiconductor device 3A to the IC socketby using the electronic component attaching tool 20A will be describedwith reference to FIGS. 5A through 8.

As described above, the movable part 32 can be moved in the direction Z2to the upper position, and be moved in the direction Z1 to the lowerposition. FIG. 5A shows the electronic component 20A that is about to beattached to the IC socket 30. In the state shown in FIG. 5A, the movablepart 32 of the IC socket 30 is located at the upper position, and thedistance between the pair of the pin end portions 33 a and 33 b isnarrow.

FIG. 5B shows the electronic component attaching tool 20A mounted on theIC socket 30. When the electronic component attaching tool 20A ismounted on the IC socket, the electronic component attaching tool 20A issimply placed (or inserted) at the depression part formed on the upperside of the movable part 32. Accordingly, it is possible to easily mountthe electronic component attaching tool 20A on the IC socket 30.

When the electronic component attaching tool 20A is mounted on the ICsocket, the engaging surface 22 of the electronic component attachingtool 20A contacts with the standard surface 35 (or the engagementsurface) of the IC socket 30 so that the position of the electroniccomponent attaching tool 20A to the IC socket can be determined.Furthermore, when the position of the electronic component attachingtool 20A to the IC socket 30 is determined, the attachment positionwhere the semiconductor device 3A can be attached to the IC socket 30can be automatically determined by the vertical surface 23B of theelectronic component attaching tool 20A. In this manner, it is possibleto align the electronic component attaching tool 20A to the IC socket 30with great ease and good operationality.

After the electronic component attaching tool 20A is mounted on the ICsocket 30, the brim part 24A is pushed in the direction F of FIG. 6C tomove the movable part 32 in the direction Z1. As described above, thepair of pin end portions 33 a and 33 b of the contact pin 33 are therebymoved in the direction of separating the pin end portions 33 a and 33 bfrom each other.

Then, while pushing the brim part 24A, the semiconductor device 3A isinserted into the opening 26 from the upper side of the electroniccomponent attaching tool 20A. In the operation of inserting thesemiconductor device 3A into the opening 26, holding of thesemiconductor device 3A is released at the position above the opening26. In this manner, by releasing the holding of the semiconductor device3A, the semiconductor device 3A drops free toward and in the opening 26.

At this time, the semiconductor device 3A can be easily inserted intothe opening 26 because the inclination surface 23A defines a largeropening part at the entrance position of the opening 26. Furthermore,since the inclination surface 23A is continuously connected to thevertical surface 23B, it is possible to smoothly advance thesemiconductor device 3A into the opening 26 defined by the verticalsurface 23B. In the first embodiment, a moving device for forciblymoving the semiconductor device 3A in the opening 26 of the electroniccomponent attaching tool 20A is not provided, but even the free drop ofthe semiconductor device 3A enables the semiconductor device 3A to beaccurately aligned and attached to the predetermined attachmentposition.

As described above, the semiconductor device 3A is guided to theattachment position by the electronic component attaching tool 20A, andFIG. 6D shows the semiconductor device 3A attached to the predeterminedposition. As shown in FIG. 6D, each bump 4 of the semiconductor device3A is located between the pair of the pin end portions 33 a and 33 b ofthe contact pin 33.

When the semiconductor device 3A is attached to the predeterminedattachment position of the IC socket 30, the pushing force applied onthe brim part 24A is released. As a result, the movable part 32 is movedin the direction Z2 by the elastic restoring force of the springs 34.Accompanying this movement of the movable part 32 in the direction Z2,the distance between the pair of the pin end portions 33 a and 33 bbecomes narrow, so that the pair of the pin end portions 33 a and 33 bsandwiches the bump 4. In this state, the contact pin 33 is electricallyconnected to the bump 4, and the semiconductor device 3A is fixed on theIC socket 30.

Next, the electronic component attaching tool 20A is removed from the ICsocket 30 as shown in FIG. 7E. When the electronic component attachingtool 20A is removed from the IC socket 30, the semiconductor device 3Ais fixed on the IC socket 30. Accordingly, the electronic componentattaching tool 20A can be removed from the IC socket 30 withoutadversely affecting the fixed position of the semiconductor device 3Aand the connected condition of the semiconductor device 3A to the ICsocket 30. In other words, after the semiconductor device 3A is attachedto the IC socket 30, the electronic component attaching tool 20A can beremoved from the IC socket 30.

In this manner, as shown in FIG. 8, even in the case where a pluralityof IC sockets (in this example, three IC sockets) that mount thesemiconductor devices 3A thereon are provided on a test substrate 36, itis not necessary to prepare three electronic component attaching tools20A. That is, one electronic component attaching tool 3A enables pluralsemiconductor devices 3A to be aligned and attached to the plural ICsockets 30-1 through 30-3, respectively.

Next, a method of attaching to the same IC socket 30 the semiconductordevices 3A and 3B whose sizes are different from each other will bedescribed with reference to FIGS. 9A through 9D. FIGS. 9A through 9Dshow the method of attaching the semiconductor device 3A to the ICsocket 30.

The procedure of this method of attaching the semiconductor device 3A tothe IC socket 30 is basically the same as the procedure shown in FIGS.5A through 7E. In this method, as shown in FIG. 9B, the electroniccomponent attaching tool 20A is mounted on the IC socket 30 of FIG. 9A.Thereafter, as shown in FIG. 9C, the semiconductor device 3A is mountedat the predetermined attachment position of the IC socket 30 by usingthe electronic component attaching tool 20A. Then, the electroniccomponent attaching tool 20A is removed from the IC socket 30 with thesemiconductor device 3A being attached to the IC socket 30.

FIG. 10E shows the same IC socket 30 as the above IC socket 30 to whichthe semiconductor device 3A is attached. As shown in FIG. 10F, when thesemiconductor device 3B is attached to the IC socket 30, the electroniccomponent attaching tool 20B that is suitable for the semiconductordevice 3B is mounted on the IC socket 30. At this time, the engagingsurface 22 of the electronic component attaching tool 20B contact withthe standard surface 35 of the IC socket 30.

As described above, the engaging surface 22 formed on the electroniccomponent attaching tool 20B is basically the same as the engagingsurface 22 formed on the electronic component attaching tool 20A. Theengaging surface 22 of the electronic component attaching tool 20Bengage with the standard surface 35 so that the opening part defined bythe vertical surface 25B can be aligned to the position corresponding tothe predetermined attachment position where the semiconductor device 3Bis attached to the IC socket 30.

Accordingly, as shown in FIG. 10G, by inserting the semiconductor device3B into the electronic component attaching tool 20B, the semiconductordevice 3B is guided and aligned to the predetermined attachment positionof the IC socket 30. Subsequently, when the semiconductor device 3B iselectrically and mechanically connected to the IC socket 30, theelectronic component attaching tool 20B is removed from the IC socket 30as shown in FIG. 10H.

According to the first embodiment of the present invention, when thesemiconductor devices 3A and 3B (whose sizes or external shapes aredifferent from each other) are attached to the IC sockets, the ICsockets 30 that are suitable for the respective semiconductor devices 3Aand 3B need not be prepared. In other words, by only selectivelyattaching the electronic component attaching tools 20A and 20B to thestandard surface 35 (the standard part) formed on the IC socket 30, itis possible to align and attach to the IC sockets 30 the semiconductordevices 3A and 3B having the different external sizes.

Furthermore, when the electronic component to be attached to the ICsocket 30 is changed from the semiconductor device 3A to thesemiconductor device 3B, the electronic component attaching tool 20A issimply replaced with the electronic component attaching tool 20B, andthe design or the like of the IC socket 30 need not be changed. In otherwords, as shown in FIG. 11, when the semiconductor devices 3A and 3Bwhose shapes or sizes are different from each other are attached to theIC socket 30, the tray 50, and the attachment substrate 90 that are theattachment objects, the electronic component attaching tools 20A and 20Bare replaced with each other in accordance with the semiconductordevices 3A and 3B, and the modification need not be applied to the ICsocket 30, the tray 50, and the attachment substrate 90.

Accordingly, when the shape or size of the semiconductor devices 3A and3B (electronic components) to be attached to the attachment objects 30,50, and 90 are changed, it is possible to promptly cope with this sizechange. Therefore, it is possible to firmly cope with the size change orthe shape change even when the life cycle of the semiconductor devices3A and 3B is short. Furthermore, it is possible to improve theserviceability ratio and the throughput by the attachment objects 30,50, and 90, so that the electronic component attaching tools 20A and 20Bof the first embodiment can contribute to the reduction in themanufacturing cost of the semiconductor devices 3A and 3B. In addition,when the size or the shape of the semiconductor devices 3A and 3B arechanged, the modification need not be applied to the attachment objects30, 50, and 90, so that equipment cost caused by the size change or theshape change of the semiconductor devices 3A and 3B can be reduced.

Next, a second embodiment of the present invention will be described.

FIG. 12 shows an electronic component attaching tool 20C according tothe second embodiment of the present invention. In the following, thesame reference numbers are attached to the elements having the samestructures as those shown in FIGS. 4 through 11, and the overlappingdescription of the same structures are omitted.

In the first embodiment, the position alignment surfaces 23 and 25 ofthe electronic component attaching tools 20A and 20B include theinclination surfaces 23A and 25A, and the vertical surfaces 23B and 25B,respectively. However, when the position alignment surfaces 23 and 25are formed by the inclination surfaces 23A and 25A, and the verticalsurfaces 23B and 25B, respectively, the level difference may begenerated between the inclination surfaces 23A and 25A and the verticalsurfaces 23B and 25B. Accordingly, the downsized semiconductor devicemay be caught by this level difference between the inclination surfaceand the vertical surface, so that there is a possibility that thesemiconductor device is not appropriately attached to the IC socket 30.

With the view of the above, according to the second embodiment, there isprovided an inclination surface that is formed on the inner surface ofthe opening and of which slope is continuously formed from the entranceposition to the exit position for the electronic component, as shown inFIG. 12. With this structure, there is no level difference on theinclination surface 37 within the range from the entrance position tothe exit position. Therefore, the downsized semiconductor device is notcaught by the opening 26 when the semiconductor device is inserted intothe opening 26. That is, it is possible to securely attach thesemiconductor device to the predetermined attachment position of theattachment object (the IC socket 30 and so on).

Next, a third embodiment of the present invention will be described.

FIG. 13 shows an electronic component attaching tool 20D according tothe third embodiment of the present invention. Similarly to the secondembodiment, the electronic component attaching tool 20D also has aposition alignment surface 23 that is continuously formed such thatthere is no level difference within the range from the entrance positionto the exit position.

In the second embodiment, as shown in FIG. 12, the inclination surface37 has the same inclination angle θ throughout the inclination surface37. Meanwhile, according to the third embodiment, the inclinationsurface 37 is basically formed by the inclination surface 23A and thevertical surface 23B, and a curved part 38 is formed at the contact partbetween an upper surface of the electronic component attaching tool 20Dand the inclination surface 23A, and at the contact part between theinclination surface 23A and the vertical surface 23B, as shown in FIG.13.

With this structure, it is possible to provide the position alignmentsurface 23 that is continuously formed from the entrance position to theexit position of the opening 26 without the level difference.Accordingly, in the third embodiment, the downsized semiconductor device(the electronic component) is not caught by the opening 26 when thesemiconductor device is inserted into the opening 26, and it is possibleto firmly attach the semiconductor device to the predeterminedattachment position of the attachment objects (the IC socket 30 or thelike).

Next, fourth and fifth embodiments of the present invention will bedescribed.

FIG. 14 shows an electronic component attaching tool 20E according tothe fourth embodiment of the present invention. FIG. 15 shows anelectronic component attaching tool 20F according to the fifthembodiment of the present invention.

The electronic component attaching tool 20E includes a coating film 39having conductive properties that is formed on the surface of the mainbody 21A. On the other hand, the electronic component attaching tool 20Fincludes a main body 21B that is formed by a conductive material. Ametal material having high conductive properties and highcorrosion-proof properties is preferably used for the coating film 39.As for the main body 21B, a resin material may be made to containconductive powders or conductive fibers so as to configure the main body21B. Alternatively, the main body 21B may be formed by a conductivemetal.

In these structures, even when static electricity is generated betweenthe semiconductor device (the electronic component) and the electroniccomponent attaching tool 20E or 20F at the time of attaching thesemiconductor device to the attachment object, the generated staticelectricity flows out via the coating film 39 or the main body 21B.Accordingly, it is possible to prevent the semiconductor device frombeing damaged by the static electricity.

Next, a sixth embodiment of the present invention will be described.

FIG. 16 and FIGS. 17A through 17C show an electronic component attachingtool 20G according to the sixth embodiment of the present invention. Inthe electronic component attaching tool 20G, a groove part includinggrooves 40A is formed on the position alignment surface 23 that definesthe opening 26. The section of the groove 40A has a rectangular shape inthis example. The groove 40A is formed so as to extend in the verticaldirections (the directions Z1 and Z2. The grooves 40A are continuouslyformed from the inclination surface 23A to the vertical surface 23B ofthe position alignment surface 23.

By forming the grooves 40A on the position alignment surface 23, evenwhen dust or the like adheres to the semiconductor device, the dustadhering to the semiconductor device is made to enter the recessionpart, i.e., the grooves 40A of the groove part when the semiconductordevice is inserted into the opening of the electronic componentattaching tool 20G. Accordingly, it is possible to prevent thesemiconductor device from being caught at the position alignment surface23 by the dust that comes in between the semiconductor device and theposition alignment surface.

With the electronic component attaching tool 20G, it is possible tofirmly attach the semiconductor device to the IC socket 30 or the like(attachment object). Furthermore, since the dust is captured by theelectronic component attaching tool 20G, it is also possible to preventthe dust from coming in between the terminal (bump) of the semiconductordevice and the contact pin 33 of the IC socket 30, improving theelectric connectivity. Furthermore, by forming the groove 40A on theposition alignment surface 23, it is possible to decrease a contact areabetween the position alignment surface and the semiconductor device. Inthis structure, when the semiconductor device slides on the positionalignment surface 23 toward the predetermined attachment position, thefriction resistance generated between the semiconductor device and theposition alignment surface is reduced. Accordingly, it is possible toprevent the semiconductor device from being caught by the electroniccomponent attaching tool 20G, and to firmly align the semiconductordevice to the predetermined attachment position of the IC socket 30.

A sectional shape of the groove 40A formed on the position alignmentsurface 23 is not limited to the rectangular shown in FIG. 16, but maybe various shapes shown in FIGS. 17A through 17C, for example. In FIG.17A, a groove 40B having a triangular sectional shape is formed on theposition alignment surface 23. In FIG. 17B, a groove 40C that iswave-shaped in section is formed on the position alignment surface 23.In FIG. 17C, a groove 40D that is U-shaped in section is formed on theposition alignment surface 23.

Next, a seventh embodiment of the present invention will be described.

FIGS. 18 through 20 are illustrations for an electronic componentattaching tool 20H according to the seventh embodiment of the presentinvention. In the first embodiment through the sixth embodiment, themain bodies 21A and 21B of the electronic component attaching tools 20Athrough 20G may be formed by materials that are not easily deformed orare not flexible.

Meanwhile, according to the seventh embodiment, a main body 21C of theelectronic component attaching tool 20H is made of an elastic materialsuch as rubber. Furthermore, in the seventh embodiment, the size of theopening 26 at the entrance position where the semiconductor device 3A isinserted into the electronic component attaching tool 20H is larger thanthe external size of the semiconductor device 3A, similarly to the aboveembodiments. However, in the seventh embodiment, the size of the opening26 at the exit position for the semiconductor device 3A is smaller thanthe external size of the semiconductor device 3A. In other words, in theexample shown in FIG. 18, the length L of the side of the opening at theexit position is smaller than the length A of the side of thesemiconductor device 3A (L<A).

With this structure, when the semiconductor device 3A is inserted intothe opening 26 from the upper side of the opening 26, the semiconductordevice 3A is engaged and (temporarily) held at the exit position of theopening 26 as shown in FIG. 18 because the size of the opening 26 at theexit position is smaller than the external size of the semiconductordevice 3A. In this manner, it is possible to transport the electroniccomponent attaching tool 20H with the semiconductor device 3A beingengaged and held by the electronic component attaching tool 20H.

Accordingly, the semiconductor device 3A is engaged (temporarily held)by the electronic component attaching tool 20H in advance, and bykeeping this state, the electronic component attaching tool 20H is thenmounted on the IC socket 30 (the attachment object) so as to align thesemiconductor device 3A. Therefore, at the same time the electroniccomponent attaching tool 20H is mounted on the IC socket 30, thesemiconductor device 3A can be attached to the IC socket 30.Accordingly, it is possible to improve the efficiency of aligning thesemiconductor device 3A.

In order to attach to the IC socket 30 the semiconductor device 3A thatis engaged and held by the electronic component attaching tool 20H, thesemiconductor device 3A is pushed toward the IC socket 30 in thedirection indicated by the arrow “B” of FIG. 19. The electroniccomponent attaching tool 20H is thereby elastically deformed, so thatthe semiconductor device 3A held by the electronic component attachingtool 20H is released and attached to the IC socket 30, as shown in FIG.19.

In the case where the electronic component attaching tool 20H is removedfrom the IC socket 30 after the semiconductor device 3A is attached tothe IC socket 30, the electronic component attaching tool 20H is raisedupward as shown in FIG. 20. At this time, the semiconductor device 3Ahas already been released from the electronic component attaching tool20H in the downward direction relative to the electronic componentattaching tool 20H, so that the semiconductor device 3A can be easilyraised upward. The elastic coefficient of the electronic componentattaching tool 20H is set in the range within which when the engagingsurface 22 of the electronic component attaching tool 20H contacts withthe standard surface 35 of the IC socket 30, the position alignmentsurface 23 enables the semiconductor device 3A to be aligned to thepredetermined attachment position of the IC socket 30 with goodaccuracy.

Next, an eighth embodiment of the present invention will be described.

FIG. 21 shows an electronic component attaching tool 201 according tothe eighth embodiment of the present invention. In the above-describedembodiments, the brim part 24A formed on the electronic componentattaching tools 20A through 20H has the shape in the plan view that isapproximately the same as the shape in the plan view of the IC socket30.

On the other hand, in the eighth embodiment, a brim part 24B extends inthe side direction (the horizontal direction) to be longer such that thesize of the brim part 24B in the plan view is larger than the size ofthe IC socket in the plan view. In other words, the length W2 of thesize of the brim part 24B is larger than the length W1 of one side ofthe IC socket 30, as shown in FIG. 21 (W2>W1).

With this structure, when the open top type IC socket 30 is operated,the IC socket 30 can be easily operated (the movable part 32 can beeasily pushed) because the area of the brim part 24B is wide.Particularly when a plurality of IC sockets 30-1 through 30-3 arearranged so as to be close to each other as shown in FIG. 8, theoperability of pushing the small movable part 32 is low. However, byusing the electronic component attaching tool 20I having the wide brimpart 24B, it is possible to efficiently perform the operation ofattaching the semiconductor device 3A to the IC socket even when aplurality of IC sockets 30-1 through 30-3 are close to each other in thearrangement.

Next, a ninth embodiment of the present invention will be described.

FIGS. 22A and 22B show electronic component attaching tools 20J and 20K,respectively according to the ninth embodiment of the present invention.In this embodiment, a position alignment mechanism for aligning theelectronic component attaching tools 20J and 20K to the IC socket 30(the attachment object) is provided.

Specifically, in the example of FIG. 22A, position alignment pins 41Aare formed on the electronic component attaching tool 20J, and positionalignment holes 42A into which the position alignment pins 41A arerespectively inserted are formed on the IC socket 30. On the other hand,in the example of FIG. 22B, position alignment holes 42A are formed onthe electronic component attaching tools 20K, and position alignmentpins 41A that are inserted into the position alignment hoes 42A,respectively are formed on the IC socket 30.

According to the ninth embodiment, when the electronic componentattaching tools 20J and 20K are mounted on the IC socket 30, not onlythe engaging surface 22 engages with the standard surface 35, but alsothe positions of the electronic component attaching tools 20J and 20Kare aligned to the IC socket 30 by the engagement of the positionalignment pins 41A and the position alignment holes 42A. Furthermore,the position alignment of the electronic component attaching tools 20Jand 20K to the IC socket 30 can be performed by only inserting theposition alignment pins 41A into the position alignment holes 42A.Accordingly, in this embodiment, it is possible to easily align thepositions of the electronic component attaching tools 20J and 20K to theIC socket 30 with further high accuracy.

Next, a tenth embodiment of the present invention will be described.

FIGS. 23A through 23C show electronic component attaching tools 20Laccording to the tenth embodiment of the present invention. In thisembodiment, a holding mechanism for holding the semiconductor device 3Ais provided on the electronic component attaching tool 20L. The holdingmechanisms of FIGS. 23A, 23B, and 23C include protrusion parts 43A, 43B,and 43C, respectively that are formed on the inner surface (the secondstructure part) of the opening 26 so as to protrude in the inwarddirection. Each of the protrusion part 43A through 43C is made of anelastic material such as rubber.

A protrusion part 43A shown in FIG. 23A is formed on the electroniccomponent attaching tool 20L so as to engage with the bump 4A of thesemiconductor device 3A when the semiconductor device 3A is mounted onthe electronic component attaching tool 20L. A protrusion part 43B shownin FIG. 23B is formed on the electronic component attaching tool 20L soas to engage with the lower surface of the package main body of thesemiconductor device 3A when the semiconductor device 3A is mounted onthe electronic component attaching tool 20L. A protrusion part 43C shownin FIG. 23C is formed on the electronic component attaching tool 20L soas to engage with the outer circumferential surface of the package mainbody of the semiconductor device 3A when the semiconductor device 3A ismounted on the electronic component attaching tool 20L.

According to the tenth embodiment, by providing the protrusion part 43A,43B, or 43C to the electronic component attaching tool 20L, it ispossible to hold the semiconductor device 3A in the electronic componentattaching tool 20L. Therefore, similarly to the electronic componentattaching tool 20H of FIG. 18 in the seventh embodiment, thesemiconductor device 3A can be held at the position alignment surface 23of the electronic component attaching tool 20L in advance, and theelectronic component attaching tool 20L that holds the semiconductordevice 3A can be aligned and attached to the IC socket 30. In thismanner, at the same time the electronic component attaching tool 20L ismounted on the IC socket 30, the semiconductor device 3A can be attachedto the IC socket 30. Accordingly, it is possible to improve theefficiency of the position alignment operation.

Furthermore, in the tenth embodiment, the holding mechanism isstructured so as to include the protrusion part 43A, 43B, or 43C that isprovided on the position alignment surface 23 such that the protrusionparts 43A, 43B, or 43C can be elastically deformed. Accordingly, theholding mechanism can be realized by a simple structure. Therefore, theprotrusion part 43A, 43B, or 43C is elastically deformed by pushing thesemiconductor device 3A in the downward direction so that thesemiconductor device 3A held by the protrusion part 43A, 43B, or 43C canbe released from the protrusion part 43A, 43B, or 43C. Then, thesemiconductor device 3A can get over the protrusion parts 43A, 43B, or43C, and can be attached to the predetermined attachment position of theIC socket 30. Therefore, the simple operation enables the semiconductordevice 3A to be released from the protrusion part 43A, 43B, or 43C andto be attached to the IC socket 30.

Next, an eleventh embodiment of the present invention will be described.

FIGS. 24A through 28E show an electronic component attaching tool 20Maccording to the eleventh embodiment of the present invention. A holdingmechanism 44 in this embodiment is shown in FIGS. 24A and 24B. FIG. 24Bis an enlarged sectional view of the part of the dashed circle indicatedby the arrow A of FIG. 24A.

The holding mechanism 44 is provided at the lower part of the main body21A of the electronic component attaching tool 20M. The holdingmechanism 44 includes a holding pin 45 and an operational pin 46. Asshown in FIG. 24B, the holding pin 45 can be rotated clockwise (asindicated by the arrow “B1”) and counterclockwise (as indicated by thearrow “B2”) with a supporting shaft 49 being the center of thisrotation. The supporting shaft 49 is provided on the main body 21A. Afirst spring 47 is provided at the right side in FIG. 24B of thesupporting shaft 49 for supporting the holding pin 45, and the firstspring 47 gives a spring force that causes the holding pin 45 to rotateclockwise in the direction B1.

On the other hand, a predetermined lower part of the operational pin 46protrudes from the bottom part of the main body 21A. An upper end partof the operational pin 46 engages with the right part in FIG. 24B of theholding pin 45 with respect to the supporting shaft 49. A second spring48 shown in FIG. 24B gives a spring force that causes the operationalpin 46 to move in the downward direction in FIG. 24B.

With this structure, in a normal state of the holding mechanism 44 wherethe operational pin 46 is not operated as shown in FIG. 24B, the lowerpart of the operational pin 46 protrudes from the bottom surface of themain body 21A. Furthermore, when the holding pin 45 rotates clockwise inthe direction B1 and is directed horizontally (that is, the holding pin45 protrudes toward the inside (i.e., the opening 26) of the main body21A from a window part 74 (position alignment surface 23) formed on themain body 21A, the state of the holding mechanism 44 becomes the normalstate.

In the normal state of the holding mechanism 44, when the semiconductordevice 3A is inserted into the electronic component attaching tool 20M,the semiconductor device 3A engages with the holding pin 45 thatprotrudes from the position alignment surface 23, and is held in theelectronic component attaching tool 20M. The semiconductor device 3A isthereby prevented from being detached from the electronic componentattaching tool 20M.

The working of the holding mechanism 44 when the operational pin 48 ismoved in the upward direction from the normal state shown in FIGS. 24Aand 24B will be described. As shown in FIG. 25B, when an upward force Fis applied to the operational pin 46, the operational pin 46 is movedupward against the spring force of the second spring 48. When theoperational pin 46 is moved upward, the holding pin 45 that engages withthe operational pin 46 is driven to rotate counterclockwise in thedirection B2 with the supporting shaft 49 being the center of therotation. The holding pin 45 is thereby rotated in the direction B2against the spring force of the first spring 47, and gets into theinside of the window part 74.

Thus, the holding pin 45 comes into the inside of the window part 74,that is, the holding pin 45 is withdrawn to the inner side of theposition alignment surface 23 so that the semiconductor device 3A heldby the holding pin 45 (the holding mechanism 44) can be released fromthe holding pin 45, and can be moved downward along the positionalignment surface 23.

FIGS. 26A through 28E show a method of attaching the semiconductordevice 3A to the IC socket 30 by using the electronic componentattaching tool 20M that has the holding mechanism 44. FIG. 26A shows theelectronic component attaching tool 20M before the electronic componentattaching tool 20M is mounted on the IC socket 30. In the state shown inFIG. 26A, the movable part 32 of the IC socket 30 is located at theupper position (the position to which the movable part 32 is moved inthe direction Z2) relative to the fixed part 31, and a width between thepair of the pin end portions 33 a and 33 b of the contact pin 33 isnarrow.

Furthermore, in the state shown in FIG. 26A, the holding mechanism 44takes the normal state, and the semiconductor device 3A is mounted onthe electronic component attaching tool 20M in advance. Since theholding mechanism 44 takes the normal state, the semiconductor device 3Aattached to the electronic component attaching tool 20M engages with theholding pin 45, so that the semiconductor device 3A is held by theelectronic component attaching tool 20M.

FIG. 26B shows the electronic component attaching tool 20M mounted onthe IC socket 30. The electronic component attaching tool 20M can beeasily mounted on the IC socket 30 only by attaching or inserting theelectronic component attaching tool 20M to the depression part formed atthe upper part of the movable part 32. As described above, at this time,the semiconductor device 3A is mounted on the electronic componentattaching tool 20M in advance, so that the attachment of the electroniccomponent attaching tool 20M to the IC socket 30, and the attachment ofthe semiconductor device 3A to the IC socket can be performedsimultaneously.

By attaching the electronic component attaching tool 20M to the ICsocket 30, the standard surface 35 contacts with the engaging surface 22so that the position of the electronic component attaching tool 20M canbe aligned to the IC socket 30. Furthermore, in the state where theposition of the electronic component attaching tool 20M is aligned tothe IC socket 30, the position of the semiconductor device 3A can bealso aligned to the IC socket 30. Thus, according to the eleventhembodiment, since the position alignment of the electronic componentattaching tool 20M to the IC socket 30, and the position alignment ofthe semiconductor device 3A to the IC socket 30 can be performedsimultaneously, it is possible to improve operability and efficiency ofattaching the electronic component attaching tool 20M and thesemiconductor device 3A to the IC socket 30. In the state shown in FIG.26B, the operational pin 46 of the holding mechanism 44 has not beenoperated yet.

Subsequently, as shown in FIG. 27C, when the electronic componentattaching tool 20M is mounted on the IC socket 30, the movable part 32is moved in the direction Z1 by pushing the electronic componentattaching tool 20M in the direction indicated by the arrows F. At theside of the fixed part 31, the pair of the pin end portions 33 a and 33b are thereby moved in the direction of being separated from each other.

Furthermore, when the movable part 32 is moved in the direction Z1, anupper surface of a contact pin housing 51 contacts against theoperational pin 46 provided at the holding mechanism 44 of theelectronic component attaching tool 20M so that the operational pin 46can be moved in the upward direction relative to the movable part 32.Thereby, the holding pin 45 is moved as in the above-described manner.That is, the holding pin 45 is rotated to the position where the holdingpin 45 is withdrawn to the inside of the vertical surface 23B. As aresult, the holding of the semiconductor device 3A by the holdingmechanism 44 is released, and the semiconductor device 3A drops freetoward the predetermined attachment position of the IC socket 30 withthe semiconductor device 3A being guided by the vertical surface 23B.The timing the holding of the semiconductor device 3A by the electroniccomponent attaching tool 20M is released can be changed by adjusting thetiming the operational pin 46 is moved or by adjusting the state of theengagement between the operational pin 46 and the holding pin 45.Accordingly, it is possible to attach the semiconductor device 3A to theIC socket 30 at an arbitrary timing.

FIG. 27D shows the semiconductor device 3A attached to the predeterminedattachment position of the IC socket 30. As shown in FIG. 27D, each ofthe bumps 4 of the semiconductor device 3A is located between the pairof the pin end portions 33 a and 33 b of the contact pin 33.

As described above, when the semiconductor device 3A is attached to thepredetermined attachment position of the IC socket 30, the pushing forceapplied to the electronic component attaching tool 20M is released.Accordingly, the elastic restoring force of the spring 34 causes themovable part 32 to move in the direction Z2 so that the width betweenthe pair of the pin end portions 33 a and 33 b can become narrow. As aresult, the bump 4 is sandwiched by the pair of the pin end portions 33a and 33 b. In this state, the bump 4 is electrically connected to thecontact pin 33, and the semiconductor device 3A is fixed to the ICsocket 30.

Then, as described in FIG. 28E, the electronic component attaching tool20M is removed from the IC socket 30. Also in this embodiment, at thistime, it is possible to remove the electronic component attaching tool20M from the IC socket 30 without adversely affecting the fixed positionof the semiconductor device 3A on the IC socket 30, and the connectedcondition of the semiconductor device 3A and the IC socket 30.Furthermore, at this time, since the electronic component attaching tool20M is separated from the IC socket, the holding pin 45 and theoperational pin 46 of the holding mechanism 44 move to the originalpositions, so that the holding mechanism 44 takes the normal stateagain.

As shown in FIG. 26A, the semiconductor device 3A is attached to theelectronic component attaching tool 20M in advance before the electroniccomponent attaching tool 20M is mounted on the IC socket 30. However,the testing of the semiconductor device 3A may be performed before thesemiconductor device 3A is attached to the IC socket 30. This testingmethod will be described with reference FIGS. 29A through 29D.

As shown in FIG. 29A, for example, the semiconductor device 3A isattached to the electronic component attaching tool 20M from a tray 50so as to be held by the holding mechanism 44. At this time, since theelectronic component attaching tool 20M has the opening 26 thatpenetrates the electronic component attaching tool 20M from the upperside to the lower side thereof, the bumps 4 of the semiconductor device3A can be seen from the lower side of the electronic component attachingtool 20M in the state in which the semiconductor device 3A is held bythe holding pin 45 (the holding mechanism 44).

For this reason, a testing device 52A shown in FIG. 29B is provided foroptically testing or inspecting the semiconductor device 3A. The testingdevice 52A has a CCD camera 53 at the lower part of the testing device52A. This CCD camera 53 can produce an image of an upper side thereof.An upper part of the testing device 52A is structured so as to mount theelectronic component attaching tool 20M on the testing device 52A.Accordingly, by mounting the electronic component attaching tool 20Mthat holds the semiconductor device 3A on the testing device 52A, it ispossible to test the bumps 4 of the semiconductor device 3A.

FIG. 29C shows one example of an image of the semiconductor device 3Aproduced by the CCD camera 53. The CCD camera 53 is connected to animage recognition processing device. Proper image data (referred to asstandard image data) of the semiconductor device 3A having the bumps 4is stored in the image recognition processing device. The imagerecognition processing device compares with the standard image data theimage data of the tested semiconductor device 3A that is received fromthe CCD camera 53. In this manner, an abnormal state of the testedsemiconductor device 3A is detected.

When there is a defect or damage (in the example shown in FIG. 29C, aloss of the bump 4) on the semiconductor device 3A, the imagerecognition processing device causes an alarm to ring, for example, inorder to make notification about the defect or the damage of thesemiconductor device 3A. Accordingly, it is possible to weed out thesemiconductor device 3A having the defect or the damage that can berecognized from the appearance thereof, improving the efficiency of thetesting.

The testing device 52A shown in FIG. 29B is structured such that the CCDcamera 53 and the semiconductor device 3A directly face each other.However, it is not always necessary that the CCD camera 53 and thesemiconductor device 3A directly face each other, and the arrangementshown in FIG. 30 of the CCD camera 53 and the semiconductor device maybe applied. As in an testing device 52B, by providing a mirror 55, it ispossible to make the testing device 52B thinner.

Next, a twelfth embodiment of the present invention will be described.

FIGS. 31 through 32C show an electronic component attaching tool 20Naccording to the twelfth embodiment of the present invention. In thisembodiment, a plurality of semiconductor devices 3A are arranged at theupper side of one another in the main body 21A of the electroniccomponent attaching tool 20N. The electronic component attaching tool20N having a plurality of the semiconductor devices 3A arranged at theupper side of one another can be mounted on the IC socket 30.Furthermore, in the twelfth embodiment, a first holding mechanism 44having the substantially same structure as the holding mechanism 44 ofthe eleventh embodiment, and a second holding mechanism 56 that isdifferent from the first holding mechanism 44 are provided at theelectronic component attaching tool 20N.

In the twelfth embodiment, the length of the main body 21A of theelectronic component attaching tool 20N is long in the upward anddownward directions. Accordingly, as shown in FIG. 31, a plurality ofthe semiconductor devices 3A can be arranged at the inside of theposition alignment surface 23 (the vertical surface 23B). The firstholding mechanism 44 is formed at the lower part of the main body 21A.The first holding mechanism 44 holds the semiconductor device 3A that islocated at the lowest level out of a plurality of the semiconductordevices 3A arranged in the position alignment surface 23. The structureof the first holding mechanism 44 is the same as that of the holdingmechanism 44 of the eleventh embodiment, and a description of thestructure of the first holding mechanism 44 is omitted.

The second holding mechanism 56 is provided at the main body 21A, andthe arranged position of the second holding mechanism 56 is higher thanthe arranged position of the first holding mechanism 44. The secondholding mechanism 56 includes a pressing contact part 57 (droppingprevention member) and a releasing lever 58 (a releasing member).

In a normal state where the releasing lever 58 is not operated, thepressing contact part 57 engages (or contacts) with and holds thesemiconductor device 3A (referred to as the second semiconductor device3A) whose level is the second lowest out of a plurality of thesemiconductor devices 3A attached in the position alignment surface 23.To be specific, the pressing contact part 57 presses the outercircumferential part of the package of the second semiconductor device3A so as to hold the second semiconductor device 3A in the electroniccomponent attaching tool 20N.

On the other hand, the pressing contact part 57 is connected to thereleasing lever 58, and by operating the releasing lever 58, thepressing contact part 57 is moved to release the pressing (engagement)of the second semiconductor device 3A by the pressing contact part 57.When the second semiconductor device 3A is released from the pressing(or the engagement) applied by the pressing contact part 57, the secondsemiconductor device 3A can move in the main body 21A of the electroniccomponent attaching tool 20N.

A process of attaching the semiconductor device 3A to the IC socket byusing the electronic component attaching tool 20N having theabove-described structure will be described with reference to FIGS. 32Athrough 32C. FIG. 32A shows the state before the semiconductor device 3Ais attached to the IC socket 30.

When the semiconductor device 3A located at the lowest level is attachedto the IC socket 30 from the state shown in FIG. 32A by using theelectronic component attaching tool 20N, the same process that isdescribed above with reference to FIGS. 26A through 28D is performed onthe electronic component attaching tool 20N.

FIG. 32B shows the state in which the semiconductor device located atthe lowest level is attached to the IC socket 30. In this state shown inFIG. 32B, the second semiconductor device 3A is held by the secondholding mechanism 56. Accordingly, even when the semiconductor device 3Alocated at the lowest level is attached to the IC socket 30, the secondsemiconductor device 3A keeps the original position in the electroniccomponent attaching tool 20N.

Therefore, it is possible to prevent a plurality of the semiconductordevices 3A arranged in the electronic component attaching tool 20N fromdropping out from the electronic component attaching tool 20N at thetime the lowest semiconductor device 3A is attached to the IC socket 30by using the electronic component attaching tool 20N. In the state shownin FIG. 32B, the electronic component attaching tool 20N is separatedfrom the IC socket 30, so that the operational pin 46 is also separatedfrom the IC socket 30, and the state of the holding pin 45 returns tothe normal state in which the operational pin 45 protrudes in theopening 26.

Subsequently, in the state shown in FIG. 32B, the releasing lever 58 ofthe second holding mechanism 56 is operated. The second semiconductordevice 3A is thereby released from the holding (the pressing) applied bythe pressing contact part 57. As a result, the second semiconductordevice 3A and a plurality of the semiconductor devices 3A arranged abovethe second semiconductor device 3A drop free.

At this time, since the state of the holding pin 45 of the first holdingmechanism 44 returns to the normal state as described above, the secondsemiconductor device is held by the first holding mechanism 44, that is,the second semiconductor device 3A becomes the semiconductor device 3Alocated at the most lowest level. Furthermore, the semiconductor device3A whose level is the third lowest in FIG. 32A is held by the secondholding mechanism 56 to become the second semiconductor device 3A.Thereafter, the above-described process is repeated so that a pluralityof the semiconductor devices 3A accommodated in the electronic componentattaching tool 20N are attached to the IC sockets 30, respectively.

As described above, according to the electronic component attaching tool20N of the twelfth embodiment, by adjusting the timing the semiconductordevice to be located at the lowest level is held by the first holdingmechanism 44, the timing the semiconductor device 3A at the lowest levelis released from the holding applied by the first holding mechanism 44,the timing the semiconductor device 3A is held by the second holdingmechanism 56, and the timing the second semiconductor device 3A isreleased from the holding applied by the second holding mechanism 56, itis possible to attach the semiconductor devices 3A to the IC sockets oneby one when a plurality of the semiconductor devices 3A are arranged atthe upper side of one another in the main body 21A. In this manner, itis possible to improve the efficiency of attaching the semiconductordevices 3A to the IC socket 30 compared with the eleventh embodiment inwhich one semiconductor device 3A is accommodated in the main body 21A.

In the twelfth embodiment, the second holding mechanism 56 holds onlythe second semiconductor device 3A. However, the holding target of thesecond holding mechanism 56 is not limited to the second semiconductordevice 3A, and the second holding mechanism 56 may hold a plurality ofthe semiconductor devices 3A together including the second semiconductordevice 3A that are arranged at the upper side of one another in the mainbody 21A.

Next, a thirteenth embodiment of the present invention will bedescribed.

FIG. 33 shows an electronic component attaching tool 20P according tothe thirteenth embodiment of the present invention. In the thirteenthembodiment, a plurality of position alignment pins 41B and 41C whosesizes are different from each other, and position alignment holes 42Band 42C to which the position alignment pins 41B and 41C are insertedconstitute a position alignment mechanism for aligning the position ofthe electronic component attaching tool 20P to the IC socket 30.

In this embodiment, the position alignment pins 41B and 41C are providedat the electronic component attaching tool 20P, and diameters of theposition alignment pins 41B are larger than diameters of the positionalignment pins 41C. Accordingly, diameters of the position alignmentholes 42B formed on the IC socket 30 are different from diameters of theposition alignment holes 42C so as to correspond to the different sizesof the position alignment pins 41B and 41C.

With this simple structure, by only changing sizes or shapes of theposition alignment pins 41B and 41C and the position alignment holes 42Band 42C, it is possible to securely align the electronic componentattaching tool 20P and the IC socket 30 to each other in the accuratedirection of the electronic component attaching tool 20P with respect tothe IC socket 30. According to the thirteenth embodiment, the advantagecan be obtained particularly when it is difficult to recognize theattachment direction of the semiconductor device 3A having a squareshape in the plan view, for example.

FIG. 34 shows an electronic component attaching tool 20Q that is amodification of the electronic component attaching tool 20P shown inFIG. 33. In this modification, a recognition mark (index mark) is formedon the upper surface of the main body 21A. Thus, with the simplestructure, by forming the recognition mark 61 on the electroniccomponent attaching tool 20Q, it is possible to prevent an error of theattachment of the semiconductor device 3A to the attachment object.

Next, a fourteenth embodiment of the present invention will bedescribed.

FIG. 35 shows an electronic component attaching tool 20R according tothe fourteenth embodiment of the present invention. In the electroniccomponent attaching tools 20A through 20N of the above-describedembodiments, one position alignment surface 23 is formed on one mainbody 21A or 21B. Meanwhile, in the fourteenth embodiment, a plurality ofposition alignment surfaces 23 are formed on one main body 21F of theelectronic component attaching tool 20R.

As shown in FIG. 35, the electronic component attaching tool 20R iseffective particularly when a plurality of IC sockets 30-1 through 30-3are provided on a test substrate 36 in advance. In other words, since aplurality of the IC sockets 30-1 through 30-3 are fixed on the testsubstrate 36, the positions of the standard surfaces 35 are alreadyknown, and are not changed.

Accordingly, the electronic component attaching tool 20R having aplurality of the position alignment surfaces 23 that correspond to theIC sockets 30-1 through 30-3, respectively can be formed. With thisstructure of the electronic component attaching tool 20R, it is possibleto align the electronic component attaching tool 20R to a plurality ofthe IC sockets 30-1 through 30-3 at once.

In the electronic component attaching tools 20A through 20N of theabove-described embodiments, when the electronic component attachingtools are attached to a plurality of the IC sockets, the separatealignment processes need to be performed to a plurality of the ICsockets 30-1 through 30-3, respectively. On the other hand, in thefourteenth embodiment, the electronic component attaching tool 20R canbe aligned to a plurality of the IC sockets 30-1 through 30-3 at once,so that the attachment process of the electronic component attachingtool 20R to the IC sockets 30-1 through 30-3 can be easily performed.

Next, a fifteenth embodiment of the present invention will be described.

FIGS. 36A through 36C show an electronic component attaching tool 20Saccording to the fifteenth embodiment of the present invention. In theelectronic component attaching tools 20A through 20R of theabove-described embodiments, when the semiconductor device 3A isattached to the predetermined attachment position of the IC socket 30,the semiconductor device 3A is inserted into the opening 26 fromdirectly above the opening 26. The opening at the entrance position fromwhich the semiconductor device 3A is inserted into the opening 26 hasthe substantially same vertical center axis as that of the opening atthe exit position (but, the area of the opening 26 at the entranceposition is different from the area of the opening 26 at the exitposition).

On the other hand, in the electronic component attaching tool 20S of thefifteenth embodiment, a sliding path 63 for sliding the semiconductordevice 3A toward the position alignment surface 23 (the second structurepart) is provided on a main body 21E of the electronic componentattaching tool 20S. In this embodiment, the opening 26 includes anopening part 26A at the entrance position and an opening part 26B at theexit position. The sliding path 63 constitutes a part (the opening part26A) of the opening 26, so that the vertical center axis P1 of theopening part 26A at the entrance position for the semiconductor device3A is not aligned to and is separated from the vertical center axis P2of the opening part 26B at the exit position for the semiconductordevice 3A.

The sliding path 63 includes a sliding groove 63A and a guiding part63B. This sliding path 63 is provided for guiding the semiconductordevice 3A to the position alignment surface 23. The guiding groove 63Ais structured such that the bumps 4 of the semiconductor device 3A donot contact with the electronic component attaching tool 20S while thesemiconductor device 3A is sliding on the sliding path 63.

To be specific, as shown in FIG. 36C, when the semiconductor device 3Aengages with the guiding part 63B, a space exists between the slidinggroove 63A and the bumps 4. With this structure, the bumps 4 areprevented from being damaged when the semiconductor device 3A is slidingon the sliding path 63. Furthermore, when the semiconductor device 3A issliding on the sliding path 63, the both ends of the package part of thesemiconductor device 3A engages with the level difference part of theguiding part 63B. Accordingly, the semiconductor device 3A can slide onthe sliding path 63 with the semiconductor device 3A being guided to theposition alignment surface 23 by the sliding path 63.

According to the fifteenth embodiment, since the semiconductor device 3Aslides on the sliding path 63 to advance to the position alignmentsurface 23, it is possible to prevent the semiconductor device 3A frombeing caught at a part of the electronic component attaching tool 20Sbefore the semiconductor device 3A reaches the position alignmentsurface 23. In addition, after the semiconductor device 3A slides on thesliding path 63 and then contacts against the position alignment surface23, the semiconductor device 3A moves to the lower side of theelectronic component attaching tool 20S (the movement of thesemiconductor device 3A is indicated by the arrow of FIG. 36A).Accordingly, it is possible to improve the accuracy in the positionalignment. Therefore, it is possible to securely guide the semiconductordevice 3A to the predetermined attachment position on the IC socket 30,and to improve the accuracy in the position alignment of thesemiconductor device 3A.

As described above, in the electronic component attaching tool 20S ofthe fifteenth embodiment, the vertical center axis P1 of the openingpart 26A at the entrance position is separated from the vertical centeraxis P2 of the opening part 26B at the exit position. Accordingly, thelong path on which the semiconductor device 3A slides can be secured, sothat the semiconductor device 3A can be firmly guided to the positionalignment surface 23. In this manner, it is possible to securely alignthe position of the semiconductor device 3A to the predeterminedattachment position of the IC socket 30.

Next, a sixteenth embodiment of the present invention will be described.

FIG. 37 shows the sixteenth embodiment of the present invention. In thisembodiment, an attachment handling device 65 is used when the electroniccomponent attaching tool is mounted on the IC socket 30. As one example,in FIG. 37, the electronic component attaching tool 20M of the eleventhembodiment that is described above with reference to FIGS. 24A and 24Bis attached to the attachment handling device 65.

An upper end part of the attachment handling device 65 is connected to arail 67. The attachment handling device 65 can be moved in thedirections Z1 and Z2, the directions X1 and X2, and the directionsorthogonal to both the directions Z1 and Z2 and the directions X1 and X2by a driving mechanism (not shown). In other words, the attachmenthandling device 65 can move three-dimensionally relative to the testingsubstrate on which the IC socket is arranged.

The attachment handling device 65 includes an attachment/detachmentmechanism 66 that attaches the electronic component attaching tool 20Mto the attachment handling device 65. With the sixteenth embodiment, theelectronic component attaching tool 20M is not limited to the use mannerin which the semiconductor device 3A is attached to the IC socket by amanual operation, and the semiconductor device 3A can be automaticallyattached to the IC socket 30 by using the attachment handling device 65.

As described above, by applying the electronic component attaching tool20M to the attachment handling device 65, the process of attaching thesemiconductor device 3A to the IC socket 30 can be performed at a higherspeed, further improving the efficiency in attaching the semiconductordevice 3A to the IC socket 30. The electronic component attaching tool20M is applied to the attachment handling device 65 as one example, butthe application to the attachment handling device 65 is not limited tothe electronic component attaching tool 20M, and the electroniccomponent attaching tools having the structure different from that ofthe electronic component attaching tool 20M may be applied to theattachment handling device 65.

In the above-described embodiments, the IC socket 30 is used as theattachment object to which the electronic component attaching tools 20Athrough 20S are applied. However, the attachment object is not limitedto the IC socket 30. In the following, other than the IC socket 30, atray 50, a tape 80, and an attachment substrate 90, for example, areused as the attachment object to which the electronic componentattaching tools 20A through 20S are applied.

FIGS. 38 through 44 show examples in which the electronic componentattaching tools are applied to the tray 50. As shown in FIGS. 38 and 39,attachment depression parts 68 for attaching the semiconductor device 3Athereto are formed on the tray 50. For example, this tray 50 is used foraccommodating the semiconductor device 3A when the semiconductor device3A is transported between a plurality of semiconductor manufacturingapparatuses or when the completed semiconductor devices 3A are shipped.

FIG. 38 shows an example in which the electronic component attachingtool 20A of the first embodiment is used when the semiconductor device3A is attached to an attachment depression part 68 of the tray 50. Astandard surface 69 is formed on an inner wall of the attachmentdepression part 68 of the tray 50. This standard surface 69 correspondsto the standard surface 35 of the IC socket 30. The forming of thestandard surface 69 does not substantially depend on the external shapesof the semiconductor devices 3A and 3B to be attached to the tray 50.The position of the electronic component attaching tool 20A is alignedto the tray 50 by making the engaging surface 22 contact with thestandard surface 69. The semiconductor device 3A is attached to theposition alignment surface 23 of the electronic component attaching tool20A to attach the semiconductor device 3A to the predeterminedattachment position of the tray 50. FIG. 39 show the tray 50 to whichtwo semiconductor devices 3A are attached.

As shown in FIGS. 38 and 39, when the semiconductor device 3A isattached to the attachment depression part 68, a clearance required forattaching the electronic component attaching tool 20A exist around thesemiconductor device 3A. Accuracy of this clearance to the standardsurface 69 is high, so that this standard surface 69 can be the standardby which the semiconductor device 3A is removed from the tray 50.

In the tray shown in FIG. 40, an adhesive sheet 70 is provided on thebottom part of the attachment depression part 69. Thus, by providing theadhesive sheet 70 to the predetermined attachment position of the tray50 at which the semiconductor device 3A is attached, it is possible tohold the semiconductor device 3A at the position to which thesemiconductor device 3A is aligned by the electronic component attachingtool 20A. Therefore, even when the electronic component attaching tool20A is removed from the tray 50, or even when the tray 50 is transportedafter the electronic component attaching tool 20A is removed from thetray 50, the semiconductor device 3A is not moved from thispredetermined attachment position.

Furthermore, in the tray 50 shown in FIGS. 41A and 41B, an upper cover71 can be put on the tray 50. As shown in FIG. 41B, the upper cover 71includes a plurality of protrusion parts 72. When the upper cover 71 isput on the tray 50, the semiconductor device 3A attached to theattachment depression part 68 is pressed by the protrusion parts 72.With this structure, the semiconductor device 3A is held at the alignedattached position by the upper cover 71, so that it is possible toprevent the semiconductor device 3A from shifting from this alignedattached position.

The tray 50 shown in FIGS. 42A and 42B is suitable for the electroniccomponent attaching tools 20J and 20K of the ninth embodiment shown inFIGS. 22A and 22B, and includes position alignment pins 41D and positionalignment holes 42D. With this structure, it is possible to apply theelectronic component attaching tools 20J and 20K to this tray 50.Accordingly, the electronic component attaching tools 20J and 20K can beattached to the tray 50 with good accuracy, and therefore, the positionof the semiconductor device 3A can be aligned to the attachment positionof the tray 50 with good accuracy.

An electronic component attaching tool 20T shown in FIG. 43 correspondsto the electronic component attaching tool 20R of the fourteenthembodiment shown in FIG. 35. A plurality of position alignment surfaces23 are formed on one main body 21F of the electronic component attachingtool 20T.

Usually, a plurality of attachment depression parts 68 are formed on thetray 50. By using the electronic component attaching tool 20T, it ispossible to attach position alignment surfaces 23 to a plurality ofattachment depression parts 68 formed on the tray 50, at once. Thereby,it is possible to improve the efficiency of attaching the semiconductordevices 3A to the tray 50.

Further, as shown in FIG. 44, also when the tray 50 is used as theattachment object, the semiconductor device 3A can be automaticallyattached to the tray 50 by using the attachment handling device 65.Thereby, it is possible to further improve the efficiency of attachingthe semiconductor devices 3A to the tray 50.

FIGS. 45A through 51 show examples in which the electronic componentattaching tool is applied to the tape 80. The tape 80 is used mainly atthe time of the shipment of the semiconductor devices 3A. As shown inFIG. 46, the tape 80 is generally wound around a reel 83. As shown inFIGS. 45A and 45B, an attachment depression part 81 for attaching thesemiconductor device 3A is formed on the tape 80.

In the example shown in FIGS. 45A and 45B, the semiconductor device 3Ais attached to the attachment depression part 81 of the tape 80 by usingthe electronic component attaching tool 20A of the first embodiment. Astandard surface 82 is formed on the inner wall of the attachmentdepression part 81 of the tape 80. Similarly to the standard surface 35of the IC socket 30, the forming of the standard surface 82 does notsubstantially depend on the external shapes of the semiconductor devices3A and 3B to be attached to the tape 80. By attaching the semiconductordevice 3A to the position alignment surface 23 of the electroniccomponent attaching tool 20A, the semiconductor device 3A is attached tothe predetermined attachment position of the tape 80.

Also in the example of FIGS. 45A and 45B, a clearance required forattaching the electronic component attaching tool 20A to the attachmentdepression part 81 exists around the semiconductor device 3A attached tothe attachment depression part 81. Accuracy of this clearance to thestandard surface 82 is high. Accordingly, when the semiconductor device3A is removed from the tape 80, the standard surface 82 becomes thestandard position for removing the semiconductor device 3A.

In the tape 80 shown in FIGS. 47A and 47B, an adhesive sheet 70 isprovided at the bottom of the attachment depression part 81. Byproviding the adhesive sheet 70 to the position of the tape 80 to whichthe semiconductor device 3A is aligned, it is possible to hold thesemiconductor device 3A at the position where the semiconductor device3A is aligned by the electronic component attaching tool 20A. Therefore,even when the electronic component attaching tool 20A is removed fromthe tape 80, or when the semiconductor device 3A is shipped afterremoving the electronic component attaching tool 20A from the tape 80,the semiconductor device 3A does not move from the aligned attachedposition on the tape 80.

Moreover, in the tape 80 shown in FIGS. 48A and 48B, an upper cover 84is put on the tape 80. As shown in FIG. 48B, the upper cover 84 includesa plurality of protrusion parts 85, when the upper cover 84 is put onthe tape 80, the protrusion parts 85 press the semiconductor device 3Aattached to the attachment depression part 81. With this structure, thesemiconductor device 3A can be held at the aligned attached position onthe tape 80 by the upper cover 85, so that it is possible to prevent thesemiconductor device 3A from moving from the aligned attached positionon the tape 80.

The tape 80 shown in FIGS. 49A and 49B is suitable for the electroniccomponent attaching tools 20J and 20K of the ninth embodiment of FIGS.22A and 22B, and includes position alignment pins 41E and positionalignment holes 42E. With this structure, the electronic componentattaching tool 20J having the position alignment pins 41A, and theelectronic component attaching tool 20K having the position alignmentholes 42A can be applied to this tape 80. Accordingly, it is possible tomount the electronic component attaching tools 20J and 20K on the tape80 with high accuracy, and therefore, the semiconductor device 3A can beattached to the predetermined attachment position on the tape 80 withhigh accuracy.

An electronic component attaching tool 20U shown in FIGS. 50A and 50Bcorrespond to the fourteenth embodiment shown in FIG. 35. That is, aplurality of position alignment surfaces 23 are formed on one main body21F of the electronic component attaching tool 20U. Usually, a pluralityof attachment depression parts 81 are formed on the tape 80.Accordingly, by using the electronic component attaching tool 20U, it ispossible to attach the position alignment surfaces 23 to a plurality ofthe attachment depression parts 81 formed on the tape 80, at once.Thereby, it is possible to improve the efficiency of attaching thesemiconductor devices 3A to the tape 80.

Furthermore, as shown in FIG. 51, also when the tape 80 is used as theattachment object, the semiconductor device 3A can be automaticallyattached to the tape 80 by using the attachment handling device 65.Thereby, it is possible to further improve the efficiency of attachingthe semiconductor device 3A to the tape 80.

FIGS. 52 through 54 show examples in which the electronic componentattaching tool is applied to the attachment substrate 90. As shown inFIG. 52, terminals 91, wiring 92, lands 93, and the like are formed onthe attachment substrate 90 in advance. When the semiconductor device 3Ais attached to the attachment substrate, the lands 93 formed on theattachment substrate 90 are connected to the bumps 4 of thesemiconductor device 3A. As described above, the semiconductor device 3Amay be the downsized CSP, and the pitch of the bumps 4 may becomenarrow. In order to certainly connect the bumps 4 to the lands 93, it isnecessary to align the position of the semiconductor device 3A to theattachment substrate 90 with high accuracy.

For this reason, as shown in FIG. 53, position alignment pins 41F andposition alignment holes 42F are formed on the attachment substrate 90.Similarly to the forming of the standard surface 35 of the IC socket 30,the forming of the position alignment pins 41F and the positionalignment holes 42F does not substantially depend on the external shapesof the semiconductor devices 3A and 3B.

By engaging the position alignment pins 41A and the position alignmentholes 42A with the position alignment holes 42F and the positionalignment pins 41F, the positions of the electronic component attachingtools 20J and 20K are aligned to the attachment substrate 90.Furthermore, the electronic component attaching tools 20J and 20K areused to attach the semiconductor devices 3A to the position alignmentsurfaces 23 so that the semiconductor devices 3A can be attached to thepredetermined attachment positions of the attachment substrate 90.Thereby, it is possible to align the position of the semiconductordevice 3A to the attachment substrate 90 with high accuracy.

Further, as shown in FIG. 54, also when the attachment substrate 90 isused as the attachment object, the semiconductor device 3A can beautomatically attached to the attachment substrate 90 by using theattachment handling device 65. Thereby, it is possible to furtherimprove the efficiency of attaching the semiconductor device 3A to theattachment substrate 90.

The present invention is not limited to these embodiments, butvariations and modifications may be made without departing from thescope of the present invention.

This patent application is based on Japanese priority patent applicationNo. 2002-273676 filed on Sep. 19, 2002, the entire contents of which arehereby incorporated by reference.

1. A method of attaching to a predetermined attachment position of anattachment object a first electronic component and a second electroniccomponent, an external size of the first electronic component beingdifferent from an external size of the second electronic component,comprising the steps of: preparing a first electronic componentattaching tool for the first electronic component, wherein the firstelectronic component attaching tool has a function of aligning the firstelectronic component to the predetermined attachment position of theattachment object; preparing a second electronic component attachingtool for the second electronic component, wherein the second electroniccomponent attaching tool has a function of aligning the secondelectronic component to the predetermined position of the attachmentobject; attaching the first electronic component attaching tool or thesecond electronic component attaching tool to a standard part formed onthe attachment object in accordance with a first case where the firstelectronic component is attached to the predetermined attachmentposition or a second case where the second electronic component isattached to the predetermined attachment position, wherein the formingof the standard part does not substantially depend on the external sizesof the first and second electronic components; in the first case, byusing the first electronic component attaching tool, attaching the firstelectronic component to the attachment object with the position of thefirst electronic component being aligned to the predetermined attachmentposition; removing the first electronic component attaching tool fromthe attachment object; in the second case, by using the secondelectronic component attaching tool, attaching the second electroniccomponent to the attachment object with the position of the secondelectronic component being aligned to the predetermined attachmentposition; and removing the second electronic component attaching toolfrom the attachment object.
 2. The method according to claim 1, whereinin the steps of removing, the first electronic component attaching toolis removed from the attachment object without adversely affecting theposition of the first electronic component and without adverselyaffecting a condition of connection between the first electroniccomponent and the attachment object, and the second electronic componentattaching tool is removed from the attachment object without adverselyaffecting the position of the second electronic component and withoutadversely affecting a condition of connection between the secondelectronic component and the attachment object.
 3. The method accordingto claim 1, wherein the first electronic component attaching toolincludes a first holding mechanism that holds the first electroniccomponent, the second electronic component attaching tool includes asecond holding mechanism that holds the second electronic component, themethod further comprises the steps of: holding the first electroniccomponent in the first electronic component attaching tool by using thefirst electronic holding mechanism before attaching the first electroniccomponent to the attachment object; and holding the second electroniccomponent in the second electronic component attaching tool by using thesecond holding mechanism before attaching the second electroniccomponent to the attachment object.
 4. The method according to claim 1,wherein the attachment object is an open top type IC socket, a tray, atape, or an attachment substrate.
 5. The method according to claim 4,further comprising the step of attaching a cover on the attachmentobject with the first electronic components and/or the second electroniccomponents being aligned and attached to the predetermined attachmentpositions of the attachment object so that the first electroniccomponents and/or the second electronic components are held at thepredetermined attachment positions by the cover.
 6. The method accordingto claim 1, wherein the first electronic component attaching toolincludes a first opening that has the function of aligning the positionof the first electronic component to the predetermined attachmentposition, the second electronic component attaching tool includes asecond opening that has the function of aligning the position of thesecond electronic component to the predetermined attachment position,the step of attaching the first electronic component comprises the stepof dropping the first electronic component free in the first opening sothat the position of the first electronic component is aligned to thepredetermined attachment position by the first electronic componentattaching tool, and the step of attaching the second electroniccomponent comprises the step of dropping the second electronic componentfree in the second opening so that the position of the second electroniccomponent is aligned to the predetermined attachment position by thesecond electronic component attaching tool.
 7. The method according toclaim 6, further comprising the steps of: optically testing the firstelectronic component via the first opening in a state where the firstelectronic component is held by the first electronic component attachingtool; and optically testing the second electronic component via thesecond opening in a state where the second electronic component is heldby the second electronic component attaching tool.
 8. The methodaccording to claim 1, wherein the first and second electronic componentsare chip size packages.
 9. The method according to claim 1, wherein thepredetermined attachment position of the attachment object is adhesive,in the step of attaching the first electronic component, the firstelectronic component is aligned and attached to the adhesivepredetermined attachment position, and in the step of attaching thesecond electronic component, the second electronic component is alignedand attached to the adhesive predetermined attachment position.